Flip chip loader accuracy optimization design approach
Chenqi Ding
Martin Core Semiconductor(Zhejiang)Co., Ltd.
Lu Bai
Martin Core Semiconductor(Zhejiang)Co., Ltd.
DOI: https://doi.org/10.59429/esta.v12i2.10556
Keywords: Flip chip loader; Geometric error; Sensitivity analysis; Precision design
Abstract
With the increasingly urgent demand for high-precision flip chip bonding machines in integrated circuit packaging technology, and in view of China’s reliance on imported high-end equipment, this study proposes an accuracy optimization design method for flip chip bonding machines.Based on the multi-body system theory, the spatial error model of the flip chip bonding machine is established, which reveals the coupling relationship between the geometrical error of the moving parts and the overall bonding accuracy.Through the error sensitivity analysis by matrix differentiation method, the critical geometric error parameters(such as line displacement error, angular displacement error and guide verticality error)are identified, and the accuracy optimization design model aiming at the minimization of manufacturing cost is constructed by this method.Combined with the genetic algorithm, 15 line displacement error parameters are globally optimized, and the results show that the optimized tolerance assignments meet the bonding accuracy requirements(X, Y, Z direction accuracy is significantly improved)while expanding the acceptable error range and reducing the manufacturing cost, realizing the synergistic optimization of performance and cost.In addition, the angular displacement error and perpendicularity error are indirectly optimized through error parameter traceability and identification, which solves the problem of synergistic optimization of multi-measurement error.This study provides theoretical support and practical guidance for the design and manufacture of domestic high-precision flip chip loader.
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