Alternating copolyoxamide with high heat resistance and excellent crystallization property via direct solid-state polymerization
Yi Guo
Zhengzhou University
DOI: https://doi.org/10.59429/esta.v13i2.14556
Keywords: alternating copolyoxamide; direct solid-state polymerization; high heat resistance; crystallization properties; polyamide
Abstract
Alternating copolyoxamides are of high interest in high-heat-resistant polyamilies owing to their regular molecular chains, high amide group density, and high intermolecular hydrogen bonds. To cope with the high melt condensation temperature, easy thermal degradation and side reactions, as well as the problem of chain structure regularity in traditional methods, we developed a direct solid-state polymerization approach to prepare alternating copolyoxamide from an equimolar diamine-oxalate precursor. At low melting temperatures and high thermal decomposition temperatures, the ordered form of the precursor is converted into a regular polymer chain structure. The structural formation, thermal stability, and crystallinity of the material were analyzed using FTIR, NMR, DSC, TGA, and XRD. Our results show that direct solid-state polymerization promotes oxalamide bond formation, reduces structural defects in high-temperature polymerization, and produces alternating copolyoxamides with a high melting temperature, high thermal decomposition temperature, and distinct crystallization peaks. We demonstrate that the alternating sequence and oxalammium hydrogen bond network lead to high heat resistance and crystallinity of a material, which can be used to create high-end engineering plastics, electronic packaging materials, and heat-deficient fiber materials.
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