Electronics Science Technology and Application

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ISSN

2424-8460(Online)

2251-2608(Print)

Article Processing Charges (APCs)

US$800

Publication Frequency

Quarterly

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Published

2025-01-06

Issue

Vol 11 No 4 (2024): Published

Section

Articles

Application of high temperature semiconductor material silicon carbide in MEMS

Yili Xu

Hangzhou spectrum Semiconductor Technology Co., LTD


DOI: https://doi.org/10.59429/esta.v11i4.8475


Keywords: High temperature semiconductor materials; Silicon carbide; Mems; Apply


Abstract

Silicon carbide high thermal conductivity, high breakdown voltage and other characteristics are significant, not only can promote the device power density and reliability improvement, but also to ensure that the production of power electronic devices to strengthen the voltage resistance, enhance the stability of the system. Because of this material property, we have found in practice that silicon carbide is not only used to manufacture power devices, but also can play a significant role in the field of micro-electromechanical. In order to solve the problems of thermal expansion and corrosion of traditional silicon-based sensors, researchers are strengthening the use of silicon carbide. This paper focuses on the high temperature semiconductor material silicon carbide, combined with the characteristics of silicon carbide, and focuses on the analysis of its application in MEMS.


References

[1] Tian Wenchao, Qian Yingying, Zhao Jingrong, et al. Research progress of microsystem packaging based on silicon Carbide devices [J]. Microelectronics & Computers, 2023, 40 (01) : 50-63.

[2] Yang Chenguang, Wang Xiufeng. Research progress on preparation and application of silicon-based SiC thin films [J]. Materials Review, 2019, 38(7) : 26-39. (in Chinese)

[3] Liang Ting, Jia Chuanling, Li Qiang, et al. Research on Capacitive High temperature Pressure Sensor based on Silicon Carbide Material [J]. Instrument Technique and Sensor, 2021, (03) : 1-3+8.



ISSN: 2424-8460
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